Q870芯片组嵌入式Micro-ATX工控主板IMB-Q870JT
1、搭载Intel® LGA1851 Core Ultra Series 2 插槽处理器（原Arrow Lake-S，最高TDP 125W） 2、强劲内存：4条DDR5 6400 MT/s CU-DIMM，最高支持256GB 3、丰富的显示选项：支持2个4K HDMI® 2.1 TMDS，1个4K DP和LVDS co-lay eDP 4、存储扩展：2个M.2 M-Key，2个SATA III，支持Intel® VMD RAID 0, 1 以及SATA RAID 0, 1, 5 5、其他扩展选项：1个M.2 E-Key，1个M.2 B-Key，1个PCIe Gen.5 x16，2个PCIe Gen.4 x4，1个PCIe Gen.4 x1 6、三个以太网连接端口：3个2.5GbE网口，实现快速可靠的网络连接 7、丰富的I/O接口：6个USB 3.2 Gen.2，6个USB 2.0，最多支持10个COM 8、增强的安全性：支持板载TPM 2.0（可选）
2、强劲内存：4条DDR5 6400 MT/s CU-DIMM，最高支持256GB
3、丰富的显示选项：支持2个4K HDMI® 2.1 TMDS，1个4K DP和LVDS co-lay eDP
4、存储扩展：2个M.2 M-Key，2个SATA III，支持Intel® VMD RAID 0, 1 以及SATA RAID 0, 1, 5
5、其他扩展选项：1个M.2 E-Key，1个M.2 B-Key，1个PCIe Gen.5 x16，2个PCIe Gen.4 x4，1个PCIe Gen.4 x1
6、三个以太网连接端口：3个2.5GbE网口，实现快速可靠的网络连接
7、丰富的I/O接口：6个USB 3.2 Gen.2，6个USB 2.0，最多支持10个COM
8、增强的安全性：支持板载TPM 2.0（可选）
| SYSTEM | |
| 版型 | Micro-ATX |
| 处理器 |
Intel® LGA1851 Socket, Processor Arrow Lake-S (MAX. TDP 125W) For additional compatible CPUs, please contact regional sales |
| 芯片组 | Intel® Q870 |
| 内存 | 4 x DDR5 6400MT/s, Dual Channel CU-DIMM, up to 256GB |
| BIOS | UEFI |
| 网络唤醒 | Yes |
| 看门狗 | 255 Levels |
| SECURITY |
Intel® PTT (Integrated fTPM) TPM2.0 (dTPM, Optional) |
| RTC BATTERY | Lithium Battery |
| 尺寸 (W X D) | 244.0 (W) x 244.0(D) mm (9.6" x 9.6") |
| OS SUPPORT |
Windows® 11 (64bit) Linux |
| POWER | |
| 供电 | ATX Power Supply |
| 上电模式 | AT / ATX (Default) Mode |
| CONNECTOR | Internal 24+8-pin ATX Header |
| DISPLAY | |
| 显示 | Intel® Graphics |
| LVDS | 1 x 24-bit Dual Channel LVDS (Max. Resolution: 1920 x 1200 @60Hz, co-layout eDP) |
| DP | 1 x DP1.4a (Max Resolution: 4096 x 2160@60Hz) |
| HDMI® | 2 x HDMI® 2.1 TMDS (Max Resolution: 4096 x 2160@60Hz) |
| MULTIPLE DISPLAY | Support 4 Displays |
| AUDIO | |
| 音频 | Realtek Audio Codec |
| Line-in | 1 x Audio Jack for Line-in |
| Line-out | 1 x Audio Jack for Line-out |
| MIC-in | 1 x Audio Jack for MIC-in |
| AMPLIFIER | 3W |
| LAN | |
| 网络 |
1 x RJ45 for Intel® I226-V 2.5GbE 1 x RJ45 for Intel® I226-LM 2.5GbE 1 x RJ45 for Realtek® RTL8156 2.5GbE |
| USB PORT | |
| USB |
6 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2) Internal Header for 2 x USB 3.2 Gen 1 Internal Header for 6 x USB 2.0 |
| SERIAL PORT | |
| COM |
1 x DB-9 for RS-232/422/485 Internal Header for 5 x DB-9 for RS-232 Internal Header for 4 x RS-232 (Optional) |
| INTERNAL I/O | |
| GPIO | 8-Bit |
| SMBUS | Yes |
| I2C | Yes |
| FAN |
1 x CPU Fan Header 2 x System Fan Header |
| FRONT PANEL |
HDD Active LED Power LED Power On/Off Reset |
| ADDITIONAL |
1 x Chassis intrusion 1 x AT/ATX Mode Selection |
| STORAGE | |
| SATA | 2 x SATA III |
| RAID | Intel® VMD RAID 0, 1 & SATA RAID 0, 1, 5 |
| EXPANSION | |
| M.2 |
1 x M-Key 2242/2260/2280/22110 (PCIe Gen4 x4) support NVMe 1 x M-Key 2242/2280 (PCIe Gen 4 x4 / SATA III) support NVMe 1 x B-Key 3042/3052 (USB 3.2/USB 2.0) for 4G/5G Module 1 x E-Key 2230 (USB 2.0/PCIe Gen 4 x1) |
| PCIe |
1 x PCIe Gen 5 x16 2 x PCIe Gen 4 x4 1 x PCIe Gen 4 x1 |
| SIM | 1 x Nano SIM Card Slot |
| ENVIRONMENT & CERTIFICATION | |
| 冲击 | 15G, 11ms duration |
| 振动 | 1 Grms/ 5~ 500Hz/ Operation |
| 工作温度 | -20°C ~ 60°C (-4°F ~ 140°F) |
| 存储温度 | -20°C ~ 85°C (-4°F ~ 185°F) |
| 相对湿度 | 10 ~ 90% relative humidity, non-condensing |
| CERTIFICATION |
CE/FCC Class A LVD |
| ESG DECLARATION |
EU RoHS China RoHS WEEE REACH TSCA Declaration PRO65 Declaration CMRT Report |
